The Electronics group comprises four sub-groups with their own respective areas of focus and capabilty development. 

Embedded Systems

The embedded systems sub-group aims to promote and support the development and implementation of the hardware and software of embedded system applications. 

    • Embedded system design and development for various micro-controllers/processors platform
    • High density, high speed PCB design
    • System-on-Chip (SoC) solutions (FPGA, PLD)
    • System level integration, modeling and verification.
    • System integration and miniaturization support 

Semiconductor

The semiconductor sub-group focuses on the implementation of complex electronics sub-systems into the silicon. 

    • Wafer fabrication
    • IC design and layout
    • IC assembly and test
    • Liquid Crystal fabrication and characterisation
    • BioMEMS 

RF/Wireless

The RF/wireless sub-group targets to provide the mobile connectivity technology of an electronics system. 

    • Design, fabrication and characterization of  PCB embedded
       passive devices 
    • High frequency/speed components test and measurement solutions
    • RF front-end circuits design, test and measurement 
    • Wireless communications system applications

Photonics and Optical Engineering

The Photonics and Optical Engineering sub-group is looking at optical system that will support applications in telecommunications, sensing, imaging and biomedical.

    • Design and testing of variable focal length microlenses
    • Liquid Crystal applications
    • Optical system design and testing
    • Holography technology